M5Stamp ESP32S3 Module
PRODUCT DETAILSDescriptionSTAMPS3is a highly integrated embedded main control core module, using Lexin ESP32-S3FN8main control chip,8MSPI flash memory, equipped with high-performance Xtensa 32-bit LX7 dual-core processor, main frequency up to 240MHz. Built-in highly integrated 5V to 3.3V circuit, RGB status indicator, programmable button, module leads out ESP32-S3 all GPIO, and in the form of 1.27MM/2.54MM spacing lead, support SMT, DIP row, DIP row and Jump wireand other ways of use; The product features compact volume, strong performance, rich expansion IO and low power consumption. The module is suitable for IoT application scenarios with embedded main control modules.FeaturesESP32-S3FN8(2.4GHz Wi-Fi)Minimal system boardMulti-IO lead-out, support multiple application forms (SMT, DIP, flying wire)Integrated programmable RGB LEDs and buttonsSupport UIFlow graphical programmingIncludes1x StampS31x HY2.0-4P terminal1 x 2.54-9P header1 x 2.54-6P header1 x Hex Key1 × User manualApplicationsSmart homeWearablesMedical equipmentSpecificationResourcesParametersMCUESP32-S3FN8DCDCHighly integrated MUN3CAD01-SCFlash8MBInput voltage5VInteractiveProgrammable physical buttons x 1, programmable RGB LED (WS2812B-2020) x 1Antenna type2.4G 3D antennaModule resource interfaceTouch sensor, SD/SDIO/MMC master controller, SPI, SDIO/SPI slave controller, EMAC, motor PWM, LED PWM, UART, I2C, I2S, GPIO, pulse counterIO interface x23G0/G1/G2/G3/G4/G5/G6/G7/G8/G9/G10/G11/G12/G13/G14/G15/G39/G40/G41/G42/G43/G44/G46Connection methodSMT/DIP (pitch 2.54mm and 1.27mm)/Jump WireIO interface spacing2.54mm和1.27mmOperating temperature0°C to 40°CProduct Size26mm × 18mm × 5mmPackage Size136mm × 92mm × 13mmProduct Weight3.2gPackage Weight7.5gLEARN AND DOCUMENTSDOCUMENTS